METHOD OF FABRICATING FLEXIBLE ELECTRONIC DEVICES

摘要

The present disclosure is related to a method of fabricating display panels, especially to a method of fabricating flexible electronic devices. By means of adding an inorganic membrane with surface roughness between a bonding layer and a PI film, in order to effectively improve the dimensional stability of plastic substrate and the water/oxygen barrier property of flexible substrate during the PI film fabrication and the follow-up process, improving the yield of good products and prolonging the working life thereof.

主权项

1. A method of fabricating flexible electronic devices, comprising:
(a) forming a separating layer on a substrate, wherein the separating layer partly covers the substrate; (b) depositing an inorganic membrane to cover the side walls and the upper surface of the separating layer, and also to cover the exposed part of the upper surface of the substrate; (c) coating a precursor of plastic substrate to cover the side walls and the upper surface of the inorganic membrane, and to partly cover the exposed part of the upper surface of the substrate; after solidification, forming a display device substrate from the plastic substrate; and (d) fabricating electronic components on surface of the display device substrate.