MULTIPROCESSOR COMPUTING APPARATUS WITH WIRELESS INTERCONNECT FOR COMMUNICATION AMONG ITS COMPONENTS

摘要

A fan less Multiprocessor Computing Apparatus is housed in a metallic container that acts as an extended heat sink and provides extended surface area for heat dissipation. The metallic container also acts as electromagnetic shield and provide immunity from of external stray magnetic fields disturbances to wireless communications among components of Multiprocessor Computing Apparatus. The wireless communication is electromagnetic type or free space optical type. The Printed Circuit Boards of Multiprocessor Computing Apparatus are mounted on inside of metallic surfaces of cubical of equal dimensions on all sides or they are mounted on inside of metallic surfaces of cylinder of height equal to its diameter. Small Multiprocessor Computing Apparatus is housed in metallic rectangular box.