MEMS MICROPHONE PACKAGING STRUCTURE

摘要

The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.

主权项

1. A MEMS microphone packaging structure, comprising:
a base having a surface and a through hole; a MEMS microphone chip having a first surface and a second surface, the first surface of the MEMS microphone chip being electrically connected to the surface of the base, and a deep hole being formed on the second surface of the MEMS microphone chip and extending to the first surface of the MEMS microphone chip; a controlling chip having a first surface and a second surface, the first surface of the controlling chip being fixed to the second surface of the MEMS microphone chip; a plurality of conductive wires electrically connected the second surface of the controlling chip with the base; and a sealing material covering the base, the MEMS microphone chip, the controlling chip and the conductive wires.