发明名称 |
BALL GRID ARRAY MOUNTING SYSTEM AND METHOD |
摘要 |
A device for providing a reliable and robust electrical connection of a chip to a board using a plurality of solder balls, the device including a non-rigid body formed of a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings formed in the body, the array of openings arranged in a pattern that matches a pattern of conductive pads on the board, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball. |
申请公布号 |
US2014252073(A1) |
申请公布日期 |
2014.09.11 |
申请号 |
US201414197911 |
申请日期 |
2014.03.05 |
申请人 |
Summit Imaging, Inc. |
发明人 |
Barredo Stephenjon Besagar |
分类号 |
H05K13/00 |
主分类号 |
H05K13/00 |
代理机构 |
|
代理人 |
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主权项 |
1. A device for providing a reliable and robust electrical connection of a ball grid array assembly to a board using a plurality of solder balls, the ball grid array assembly having a plurality of conductive pads arranged in a pattern, the board also having a plurality of conductive pads arranged in a pattern that is a mirror of the pattern on the board, the device comprising:
a non-rigid body comprising a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings in the body, the array of openings arranged in a pattern that matches the pattern of the conductive pads on the ball grid array assembly, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball. |
地址 |
Woodinville WA US |