Method and Apparatus for Connecting Packages onto Printed Circuit Boards

摘要

Methods and apparatus are disclosed for attaching the integrated circuit (IC) packages to printed circuit boards (PCBs) to form smooth solder joints. A polymer flux may be provided in the process to mount an IC package to a PCB. The polymer flux may be provided on connectors of the IC package, or provided on PCB contact pad and/or pre-solder of the PCB. When the IC package is mounted onto the PCB, the polymer flux may cover a part of the connector, and may extend to cover a surface of the molding compound on the IC package. The polymer flux may completely cover the connector as well. The polymer flux delivers a fluxing component that facilitates smooth solder joint formation as well as a polymer component that offers added device protection by encapsulating individual connectors. The polymer component may be an epoxy.

主权项

1. A method of forming a device, comprising:
providing an integrated circuit (IC) package comprising a connector and an IC; providing a printed circuit board (PCB) comprising a PCB contact pad; providing a polymer flux; and forming a connection between the PCB contact pad and the connector, wherein the polymer flux covers at least a part of the connector.