VIA-ENABLED PACKAGE-ON-PACKAGE

摘要

A via-enabled package-on-package circuit includes a first package including a first package die having a plurality of through substrate vias (TSVs). The TSVs are configured to carry the input/output signaling for at least one second package die.

主权项

1. An integrated circuit package, comprising:
a first package including a first package substrate and a first package die mounted thereon, wherein the first package die includes a plurality of first through substrate vias (TSVs); and a second package including a second package substrate and at least one second package die mounted on a first surface of the second package substrate, the second package substrate having an opposing second surface having attached thereon a plurality of first interconnects, wherein the first TSVs are configured to couple to the at least one second package die through the first interconnects such that the input/output signaling for the at least one second package die is conducted by the first TSVs.