JOINTING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive jointing material which achieves sufficient joint strength without compression.SOLUTION: There is provided the jointing material comprising: a copper nanoparticle paste formed of a fluid dispersion formed by uniformly dispersing copper nanoparticles having a coating molecular layer on their surfaces into a dispersion solvent; and a copper micro particle or a copper sub-micro particle, or both of them. There are also provided a production method of electronic components using the same, and a joint method of metal members.