发明名称 |
METHOD OF DESIGNING ARRANGEMENT OF TSV IN STACKED SEMICONDUCTOR DEVICE AND DESIGNING SYSTEM FOR ARRANGEMENT OF TSV IN STACKED SEMICONDUCTOR DEVICE |
摘要 |
A method of designing arrangement of through silicon vias (TSVs) in a stacked semiconductor device is provided The method includes: determining a plurality of TSV candidate grids representing positions, into which the TSVs are insertable, in each of a plurality of semiconductor dies stacked mutually and included in a stacked semiconductor device; creating a plurality of path graphs representing linkable signal paths for a plurality of signals transmitted through the stacked semiconductor device, respectively, based on the TSV candidate grids; determining initial TSV insertion positions corresponding to shortest signal paths for the signals based on the path graphs; and determining final TSV insertion positions by verifying the initial TSV insertion positions so that a plurality of signal networks corresponding to the shortest signal paths for the signals have routability. |
申请公布号 |
US2014258949(A1) |
申请公布日期 |
2014.09.11 |
申请号 |
US201414203650 |
申请日期 |
2014.03.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG Myung-Soo;LEE Jae-Rim;CHONG Jong-Wha;KIM Min-Beom;LI Wen Rui;JANG Cheol-Jon |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of designing arrangement of through silicon vias (TSVs) in a stacked semiconductor device, the method comprising:
determining a plurality of TSV candidate grids representing positions, into which the TSVs are insertable, in each of a plurality of semiconductor dies stacked mutually and included in the stacked semiconductor device; creating a plurality of path graphs representing linkable signal paths for a plurality of signals transmitted through the stacked semiconductor device, respectively, based on the TSV candidate grids; determining initial TSV insertion positions corresponding to shortest signal paths for the signals based on the path graphs; and determining final TSV insertion positions by verifying the initial TSV insertion positions so that a plurality of signal networks for the signals have routability. |
地址 |
Suwon-si KR |