发明名称 Resin-sealed electronic device
摘要 <p>Degradation of post-sealing water-resistant performance is suppressed. An electronic device includes: a case member that includes a first end portion (310a) and a second end portion (310b); a flow control member (66) that includes a first opening (66a) and a second opening (66b); and a sealing resin (120) that is formed by solidification of a resin injected through a gate after the resin spreads into the case member by flowing in a first flow path between an inner surface (310k) of the case member and an outer surface (66n) of the flow control member (66) and a second flow path (66G) in the flow control member (66). Cross sectional shapes of the first flow path and the second flow path are determined such that the resin flowing in the first flow path reaches the second opening (66b) earlier than the resin flowing in the second flow path.</p>
申请公布号 EP2775514(A2) 申请公布日期 2014.09.10
申请号 EP20130191897 申请日期 2013.11.07
申请人 OMRON CORPORATION 发明人 SANDA, TAKAAKI;NISHIKAWA, KAZUYOSHI;SUGIMOTO, MAKOTO;YURI, TAKASHI;HONJO, TAKUYA;KAMEDA, TAKAMASA;INOUE, DAISUKE;HIRAO, KOICHI;KOTANI, SHINJIRO;NAKAYAMA, YUSUKE
分类号 H01L23/24;G01D11/24;H01L23/00;H03K17/95;H05K5/06 主分类号 H01L23/24
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