Semiconductor devices

摘要

A semiconductor device includes: a semiconductor chip(401); an extension layer (405) extending laterally from a boundary of the semiconductor chip (401a); a redistribution layer (409) disposed over at least one side of the extension layer and the semiconductor chip, wherein the redistribution layer electrically couples at least one contact (410) of the semiconductor chip to at least one contact of an interface (412) , wherein at least a part of the interface extends laterally beyond the boundary of the semiconductor chip.