| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor chip fixed on a main surface of an arranging board is electrically connected to a connection terminal via wire, and the semiconductor device then provides a resin seal with the semiconductor chip and the wire and suppresses a generation of crack in an adhesive bonding the semiconductor chip to the arranging board, and improving the reliability while ensuring the safety. SOLUTION: A rigid resin layer 21 sealing a main surface 12a of an arranging board 12, a semiconductor chip 13 and wire 15, and a soft resin layer 22 softer than the rigid resin layer 21 and having flowability, are laminated in series on the main surface 12a of the arranging board 12. A distance from a wire 15 positioned in the rigid resin layer 21 to the soft resin layer 22 is set based on energy generated in the case of the disconnection of the wire 15 so that a crack generated in the rigid resin layer 21 arrives to the soft resin layer 22. COPYRIGHT: (C)2012,JPO&INPIT |
