发明名称 |
Device and method for releasing a semiconductor wafer from a carrier substrate with the use of a solvent and acoustic waves |
摘要 |
The device is provided with a film with an adhesive layer (3s) to accommodate the product substrate in a contacting surface section (3k) of the film. The film is mounted in a mounting section (3b) encasing the contacting surface section. A separating section (3a) is placed between the contacting surface section and the mounting section. An independent claim is also included for a method for separating a product substrate from a carrier substrate. |
申请公布号 |
EP2667407(A3) |
申请公布日期 |
2014.09.10 |
申请号 |
EP20130180205 |
申请日期 |
2009.09.01 |
申请人 |
EV GROUP GMBH |
发明人 |
LINDNER, FRIEDRICH PAUL;BURGGRAF, JÜRGEN |
分类号 |
H01L21/67;H01L21/683 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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