SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device which can reduce a heat stress to a solder layer with suppressing an increase of thermal resistance is provided. A semiconductor device comprises a semiconductor element (5), a solder layer (4) which is arranged on at least one surface of the semiconductor element and a lead frame (2) which is arranged on the solder layer so that a porous nickel plating part (1) is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.