发明名称 |
MOLD-RELEASING FILM AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE |
摘要 |
Provided is a release film for producing a light emitting diode having desired concaves and convexes accurately transferred directly to the surface of a resin-sealed portion, at a low cost and in high yield, and a process for producing a light emitting diode. A release film 10 having a plurality of convex portions (convex stripes 12) and/or concave portions (grooves 14) formed on the surface is used as a release film to be placed in a cavity of a mold for forming a resin-sealed portion to seal a light emitting element of a light emitting diode. |
申请公布号 |
EP2374590(B1) |
申请公布日期 |
2014.09.10 |
申请号 |
EP20100729232 |
申请日期 |
2010.01.07 |
申请人 |
ASAHI GLASS COMPANY, LIMITED |
发明人 |
HIGUCHI, YOSHIAKI;YUKAWA, YASUMASA |
分类号 |
B29C33/68;B29C45/14;B29L31/36;H01L21/56;H01L33/54 |
主分类号 |
B29C33/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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