| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure a bonding strength and achieve an improvement in bonding reliability in stitch bonding at wire bonding. <P>SOLUTION: Height control of a capillary is performed in stitch bonding (2nd bonding) at wire bonding, so that the thickness of the stitch portion can be controlled, thereby ensuring the bonding strength and achieving the improvement in the bonding reliability. Also, since the thickness of the stitch portion can be ensured, copper lines can be used for wire bonding and the cost of the wire bonding can be reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT |
