Method for etching a material in the presence of solid particles

摘要

The invention relates to a method for etching a structure (1) including at least one material (4) to be etched, said method consisting in: selecting at least one chemical species that can react with the material (4) to be etched; selecting at least one soluble compound that can release this chemical species; producing a solution (11) containing the compound and a powder of particles or solid grains (13) in suspension; placing the material to be etched in the presence of the solution; and producing high-frequency ultrasounds in the solution, at at least one frequency, capable of generating active cavitation bubbles such that the chemical species is generated and reacts with the material to be etched, thereby producing a soluble compound or a precipitate.

主权项

1. A method for etching a structure comprising at least one material to be etched, comprising:
choosing at least one chemical species capable of reacting with the material to be etched; choosing at least one soluble compound that does not react with said material but which is able to release the aforementioned chemical species; producing a solution containing said compound and containing a powder of solid grains or particles in suspension; placing the material to be etched in the presence of the solution; and producing high-frequency ultrasound in the solution with at least one frequency capable of generating active cavitation bubbles in the presence of said powder of solid grains or particles, such that the chemical species is generated and reacts with the material to be etched, while producing a soluble compound or a precipitate.