APPARATUS AND METHODS FOR PACKAGING INTEGRATED CIRGUIT CHIPS WITH ANTENNAS FORMED FROM PACKAGE LEAD WIRES

摘要

Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.