Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound

摘要

A method of packaging integrated circuits includes providing a molded substrate including a first plurality of functional semiconductor dies and a plurality of placeholders laterally spaced apart from one another and covered by a molding compound. The molding compound is thinned to expose at least some of the placeholders. The exposed placeholders are removed to form cavities in the molded substrate. A second plurality of functional semiconductor dies is inserted in the cavities formed in the molded substrate. Electrical connections are formed to the first plurality and second plurality of functional semiconductor dies at a side of the dies uncovered by the molding compound.

主权项

1. A method of packaging integrated circuits, the method comprising:
providing a molded substrate including a first plurality of functional semiconductor dies and a plurality of placeholders laterally spaced apart from one another and covered by a molding compound; thinning the molding compound to expose at least some of the placeholders; removing the exposed placeholders to form cavities in the molded substrate; inserting a second plurality of functional semiconductor dies in the cavities formed in the molded substrate; and forming electrical connections to the first plurality and second plurality of functional semiconductor dies at a side of the dies uncovered by the molding compound.