| 发明名称 | Semiconductor package and fabrication method thereof | ||
| 摘要 | A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability. | ||
| 申请公布号 | US8829687(B2) | 申请公布日期 | 2014.09.09 |
| 申请号 | US201213722138 | 申请日期 | 2012.12.20 |
| 申请人 | Siliconware Precision Industries Co., Ltd. | 发明人 | Chan Mu-Hsuan;Chen Wan-Ting;Liao Yi-Chian;Lin Chun-Tang;Lai Yi-Chi |
| 分类号 | H01L23/48;H01L21/00;H01L21/78;H01L23/00;H01L23/498 | 主分类号 | H01L23/48 |
| 代理机构 | Edwards Wildman Palmer LLP | 代理人 | Edwards Wildman Palmer LLP ;Corless Peter F.;Jensen Steven M. |
| 主权项 | 1. A semiconductor package, comprising: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip. | ||
| 地址 | Taichung TW | ||