发明名称 Semiconductor device and method of manufacture
摘要 A system and method for forming an isolation trench is provided. An embodiment comprises forming a trench and then lining the trench with a dielectric liner. Prior to etching the dielectric liner, an outgassing process is utilized to remove any residual precursor material that may be left over from the deposition of the dielectric liner. After the outgassing process, the dielectric liner may be etched, and the trench may be filled with a dielectric material.
申请公布号 US8828841(B2) 申请公布日期 2014.09.09
申请号 US201414153854 申请日期 2014.01.13
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Peng Chih-Tang;Chen Bing-Hung;Lee Tze-Liang;Lien Hao-Ming
分类号 H01L21/44;H01L21/768;H01L21/285 主分类号 H01L21/44
代理机构 Slater and Matsil, L.L.P. 代理人 Slater and Matsil, L.L.P.
主权项 1. A method of manufacturing a semiconductor device, the method comprising: forming an opening in a substrate; lining the opening with a first dielectric material; degassing the first dielectric material to form a degassed dielectric material; and performing a first self-limiting etch on the degassed dielectric material.
地址 Hsin-Chu TW