Method of manufacturing liquid jet head, liquid jet head, and liquid jet apparatus

摘要

In a method of manufacturing a liquid jet head, a piezoelectric substrate is bonded onto a first base. Ejection grooves for ejection channels and dummy grooves for dummy channels are alternately formed in parallel with one another. The ejection grooves and the dummy grooves have such a depth as to pierce the piezoelectric substrate and to reach the first base substrate. An electrode material is deposited on inner surfaces of the ejection grooves and the dummy grooves. A cover plate is bonded to the piezoelectric substrate so as to cover the ejection grooves and the dummy grooves. In a subsequent first base substrate removing step, a part of the first base substrate on a side opposite to the cover plate and the electrode material deposited on bottom surfaces of the dummy grooves are removed. A second base substrate is then bonded to the first base substrate.

主权项

1. A method of manufacturing a liquid jet head, comprising:
a stacked substrate forming step of bonding a piezoelectric substrate onto a first base substrate to form a stacked substrate having a first end and a second end opposite the first end; a groove forming step of alternately forming ejection grooves for ejection channels and dummy grooves for dummy channels in parallel with one another, the ejection grooves and the dummy grooves having such a depth as to pierce the piezoelectric substrate and to reach the first base substrate, the dummy grooves being formed so as to be deeper than the ejection grooves, the depth of each of the dummy grooves being constant from the first end to the second end of the stacked substrate; an electrode material depositing step of depositing an electrode material on inner bottom and side surfaces of the ejection grooves and the dummy grooves; a cover plate bonding step of bonding a cover plate to the piezoelectric substrate so as to cover the ejection grooves and the dummy grooves; a first base substrate removing step of removing a part of the first base substrate on a side opposite to the cover plate to open the bottom surfaces of the dummy grooves, thereby collectively removing the electrode material deposited on the bottom surfaces of the dummy grooves to electrically separate the electrode material formed on opposite side surfaces of each of the dummy grooves from each other; and a second base substrate bonding step of bonding a second base substrate to the first base substrate.