发明名称 |
Electrode forming apparatus |
摘要 |
The invention aims at reducing unevenness at the intersections of mutually crossing electrodes with a method of and an apparatus for forming electrodes on a substrate. After forming a number of finger electrodes on a substrate, wide bus electrodes intersecting them are formed by application of an application liquid. Upon applying the application liquid which contains an electrode material and a photo-curing resin to the substrate, the application liquid is irradiated with UV light after a predetermined time and the application liquid is thus made to harden. A time difference since applying until light irradiation is set based on the result of measurement on changes of the height of the application liquid experimentally applied. |
申请公布号 |
US8826518(B2) |
申请公布日期 |
2014.09.09 |
申请号 |
US201113011245 |
申请日期 |
2011.01.21 |
申请人 |
Dainippon Screen Mfg. Co., Ltd. |
发明人 |
Sanada Masakazu |
分类号 |
B23P19/00;H05K13/04;H01L31/0224 |
主分类号 |
B23P19/00 |
代理机构 |
Ostrolenk Faber LLP |
代理人 |
Ostrolenk Faber LLP |
主权项 |
1. An electrode forming apparatus, comprising:
a substrate holder for holding a substrate which seats finger electrodes which extend in a first direction; a nozzle which discharges an application liquid which contains an electrode material; a light irradiator which irradiates light upon the application liquid applied to the substrate so as to harden the application liquid; a mover which moves the nozzle and the light irradiator relative to the substrate in a second direction which is different from the first direction; and an adjuster which adjusts a time since application of the application liquid to the substrate until hardening is performed by the light irradiator; wherein the light irradiator is held so as to be movable relative to the nozzle in the second direction; and wherein the mover moves the nozzle and the light irradiator together relative to the substrate, and the adjuster adjusts a distance between the nozzle and the light irradiator taken in the second direction. |
地址 |
JP |