| 发明名称 | Integrated circuit | ||
| 摘要 | An integrated circuit connection comprises a substrate, first and second transmission lines, a die, and a conductive ribbon. The first transmission line has a first end and is arranged on the substrate. The die is spaced from the first end. The die has a first surface, which is arranged on the substrate, and a second surface, which is opposite to the first surface and which has the second transmission line arranged thereon. The second transmission line has a second end. The conductive ribbon electrically couples the first and the second ends. | ||
| 申请公布号 | US8829659(B2) | 申请公布日期 | 2014.09.09 |
| 申请号 | US201012850201 | 申请日期 | 2010.08.04 |
| 申请人 | Sony Corporation | 发明人 | Sun Xiaobing;Zhang Yaqiong;Ma Yugang |
| 分类号 | H01L29/93 | 主分类号 | H01L29/93 |
| 代理机构 | Dentons US LLP | 代理人 | Dentons US LLP |
| 主权项 | 1. An integrated circuit comprising: a substrate; a first transmission line on the substrate, the first transmission line having a first end; a die having a first surface on the substrate and a second surface facing away from the first surface, the die being spaced from the first end; a second transmission line on the second surface of the die, the second transmission line having a second end; and a conductive ribbon electrically coupling the first end and the second end, the conductive ribbon including a main portion which continuously increases in width, wherein, the main portion varies in width as a height of the conductive ribbon varies from a surface of the substrate. | ||
| 地址 | Tokyo JP | ||