发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
In one embodiment, a method of manufacturing a semiconductor device includes forming an amorphous semiconductor film on a substrate. The method further includes annealing the amorphous semiconductor film by irradiating the substrate with a microwave to form a polycrystalline semiconductor film from the amorphous semiconductor film. The method further includes forming a transistor whose channel is the polycrystalline semiconductor film. |
申请公布号 |
US8828853(B2) |
申请公布日期 |
2014.09.09 |
申请号 |
US201213415232 |
申请日期 |
2012.03.08 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Aoyama Tomonori;Miyano Kiyotaka |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
主权项 |
1. A method of manufacturing a semiconductor device, the method comprising:
forming an amorphous semiconductor film on a substrate; annealing the amorphous semiconductor film by irradiating the substrate with a microwave to form a polycrystalline semiconductor film from the amorphous semiconductor film, the annealing including a first annealing performed at a first substrate temperature, and a second annealing performed at a second substrate temperature lower than the first substrate temperature after the first annealing; cooling the substrate between the first annealing and the second annealing to decrease a temperature of the substrate from the first substrate temperature to the second substrate temperature; and forming a transistor whose channel is the polycrystalline semiconductor film. |
地址 |
Tokyo JP |