发明名称 Semiconductor device and method of manufacturing the same
摘要 In one embodiment, a method of manufacturing a semiconductor device includes forming an amorphous semiconductor film on a substrate. The method further includes annealing the amorphous semiconductor film by irradiating the substrate with a microwave to form a polycrystalline semiconductor film from the amorphous semiconductor film. The method further includes forming a transistor whose channel is the polycrystalline semiconductor film.
申请公布号 US8828853(B2) 申请公布日期 2014.09.09
申请号 US201213415232 申请日期 2012.03.08
申请人 Kabushiki Kaisha Toshiba 发明人 Aoyama Tomonori;Miyano Kiyotaka
分类号 H01L21/20 主分类号 H01L21/20
代理机构 Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. 代理人 Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
主权项 1. A method of manufacturing a semiconductor device, the method comprising: forming an amorphous semiconductor film on a substrate; annealing the amorphous semiconductor film by irradiating the substrate with a microwave to form a polycrystalline semiconductor film from the amorphous semiconductor film, the annealing including a first annealing performed at a first substrate temperature, and a second annealing performed at a second substrate temperature lower than the first substrate temperature after the first annealing; cooling the substrate between the first annealing and the second annealing to decrease a temperature of the substrate from the first substrate temperature to the second substrate temperature; and forming a transistor whose channel is the polycrystalline semiconductor film.
地址 Tokyo JP