发明名称 Method and apparatus for ripping plate material, and plate material
摘要 A method of ripping a plate material having a resilient part, a frame, and an easily breaking part formed between the resilient part and the frame includes holding the frame between an upper pad and a die on a first side of the easily breaking part, moving a punch toward a lower pad that is retractable against pushing force, to clamp the resilient part between the punch and the lower pad on a second side of the easily breaking part, and driving the punch so that the punch guides the plate material and applies tension to the easily breaking part in a surface direction of the plate material, thereby ripping the plate material along the easily breaking part. The method is capable of ripping the plate material without causing burrs.
申请公布号 US8827130(B2) 申请公布日期 2014.09.09
申请号 US201113172981 申请日期 2011.06.30
申请人 NHK Spring Co., Ltd. 发明人 Inoue Hidenori
分类号 B32B3/00;B26F3/02;G11B5/48;B26F1/40;B21D28/16 主分类号 B32B3/00
代理机构 Jordan and Hamburg LLP 代理人 Jordan and Hamburg LLP
主权项 1. A method of ripping a plate material having a first part at which the plate material is to be ripped, comprising steps of: holding the plate material at a first side of the first part between an upper mold and a lower mold in a thickness direction of the plate material; clamping the plate material at a second side of the first part between a punch and a pad in the thickness direction of the plate material by moving the punch toward the pad, the pad being positioned beneath the punch, an edge of the punch in a width direction orthogonal to the thickness direction overhanging the plate material at said first side of the first part and the punch extending across the first part in the width direction; moving in the thickness direction the punch, the plate material at said second side, and the pad positioned beneath the punch, so that the second side is at a different elevation along the thickness direction than at least a first portion of the plate material at said first side; and during said moving, deforming a second portion of the plate material at said first side by contacting said second portion against a guide face surface of the punch, said guide face surface being located toward said punch edge so as to overhang the plate material at said first side in the width direction, said second portion being located between said first part and a portion of the plate material being held at said first side; and applying tension, through operation and guiding of the punch, to the first part in the width direction, after said holding and said clamping and during said moving, in a manner for pulling the first side from the second side in the width direction without bending the first part into a different elevation relative to the thickness direction so as to rip the plate material along the first part.
地址 Kanagawa JP