Semiconductor package and method of manufacturing the same

摘要

A semiconductor package and a method of manufacturing the same are provided, the semiconductor package including a first package unit having a first encapsulant and a first semiconductor element, a second package unit having a second encapsulant and a second semiconductor element, a supporting member interposed between the first and second encapsulant, a plurality of conductors penetrating the first encapsulant, the supporting member and the second encapsulant, and redistribution structures disposed on the first and second encapsulants, wherein the first and second encapsulants are coupled with each other by the supporting member to provide sufficient support and protection to enhance the structure strength of the first and second package units.

主权项

1. A semiconductor package, comprising:
a first package unit, including a first encapsulant having opposite first and second sides, and a first semiconductor element embedded in the first encapsulant and exposed to the first side; a second package unit, including a second encapsulant having opposite third and fourth sides, and a second semiconductor element embedded in the second encapsulant and exposed to the third side; a supporting member connecting the second side of the first encapsulant to the fourth side of the second encapsulant so as to couple the first package unit to the second package unit; a plurality of conductors penetrating the first encapsulant, the supporting member and the second encapsulant so as to connect the first side of the first encapsulant to the third side of the second encapsulant; and redistribution layer structures disposed on the first side of the first encapsulant and the third side of the second encapsulant, such that the redistribution layer structures are electrically connected to the conductors and first and second semiconductor elements.