| 主权项 |
1. A semiconductor device including an element unit having a semiconductor element, a condenser electrically connected to the element unit, a control board that controls the semiconductor element, and a cooler that has an element unit arrangement surface arranged such that the element unit is mounted on the element unit arrangement surface, and cools the element unit arranged on the element unit arrangement surface, comprising
a support member that has a condenser housing chamber that houses the condenser, and a board fixing portion that is across the condenser housing chamber from the cooler and has the control board fixed to the board fixing portion, wherein the condenser has two parallel planar surfaces that are parallel with each other, the condenser housing chamber has a parallel opposing surface that is arranged in parallel with the element unit arrangement surface and faces the element unit arrangement surface, and houses the condenser in a state where the two parallel planar surfaces are arranged in parallel with the parallel opposing surface, and the support member is fixed to the cooler in a state where the parallel opposing surface presses the element unit toward the cooler. |
