Method for producing semiconductor device and semiconductor device

摘要

A method for producing a semiconductor device includes forming a fin-shaped silicon layer, a first insulating film around the fin-shaped silicon layer, a pillar-shaped silicon layer on the fin-shaped silicon layer, a gate electrode and a gate insulating film around the pillar-shaped silicon layer, a gate line connected to the gate electrode, a first diffusion layer in an upper portion of the pillar-shaped silicon layer, a second diffusion layer in a lower portion of the pillar-shaped silicon layer and an upper portion of the fin-shaped silicon layer, and a first silicide and a second silicide on the first diffusion layer and the second diffusion layer; an interlayer insulating film to expose an upper portion of the pillar-shaped silicon layer; etching the interlayer insulating film to form a contact hole; depositing a metal to form the first contact on the second silicide; and performing etching to form the metal wire.

主权项

1. A method for producing a semiconductor device, the method comprising:
a first step of forming a fin-shaped silicon layer on a silicon substrate, forming a first insulating film around the fin-shaped silicon layer, and forming a pillar-shaped silicon layer in an upper portion of the fin-shaped silicon layer; a second step of forming a gate insulating film around the pillar-shaped silicon layer, a gate electrode around the gate insulating film, and a gate line connected to the gate electrode; a third step of forming a first diffusion layer in an upper portion of the pillar-shaped silicon layer and a second diffusion layer in a lower portion of the pillar-shaped silicon layer and an upper portion of the fin-shaped silicon layer; a fourth step of forming a first silicide and a second silicide on the first diffusion layer and the second diffusion layer; and after the fourth step, a fifth step of depositing an interlayer insulating film, planarizing and etching-back the interlayer insulating film to expose an upper portion of the pillar-shaped silicon layer, forming a fifth resist for forming a first contact after the upper portion of the pillar-shaped silicon layer is exposed, etching the interlayer insulating film to form a contact hole, depositing a metal to form the first contact on the second silicide, forming a sixth resist for forming a metal wire, and performing the etching to form the metal wire.