Printed circuit board and method of manufacturing printed circuit board

摘要

A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternately laminated on the core substrate, solder bumps formed on an outer surface of the printed circuit board, a first capacitor formed in the opening of the second resin substrate, a conductive pad formed on the first resin substrate and connected to an electrode of the first capacitor, a via hole formed in the first resin substrate and directly connected to the conductive pad and a conductive circuit on the core substrate, and a second capacitor mounted on a surface of the printed circuit board.

主权项

1. A method for manufacturing a printed circuit board comprising:
forming a through hole in a resin substrate; positioning a plurality of chip capacitors in the through hole of the resin substrate such that the plurality of chip capacitors is accommodated in the through hole of the resin substrate, and that the chip capacitors are positioned laterally with respect to one another; forming a first buildup structure comprising an interlayer resin insulating layer and a conductive layer over a first surface of the resin substrate and the plurality of chip capacitors accommodated in the through hole of the resin substrate; forming a second buildup structure comprising an interlayer resin insulating layer and a conductive layer over a second surface of the resin substrate and the plurality of chip capacitors accommodated in the through hole of the resin substrate on an opposite side with respect to the first buildup structure; and forming on a surface of the first buildup structure a plurality of bump structures positioned to mount an IC chip such that the plurality of chip capacitors in the through hole of the resin substrate is positioned directly below the IC chip, wherein after the positioning of the plurality of chip capacitors in the through hole, the forming of the first buildup structure and the forming of the second buildup structure are performed such that the plurality of chip capacitors is positioned between the first and second buildup structures.