| 发明名称 | Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate | ||
| 摘要 | An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener (6), (B) a bonding material (5), (C) a cured film obtained by curing a photosensitive resin composition (4), and (D) a flexible printed circuit board (1) are laminated in this order. | ||
| 申请公布号 | US8828525(B2) | 申请公布日期 | 2014.09.09 |
| 申请号 | US201113822424 | 申请日期 | 2011.07.08 |
| 申请人 | Kaneka Corporation | 发明人 | Kido Masayoshi;Kogiso Tetsuya;Sekito Yoshihide |
| 分类号 | B32B3/00;H05K3/00;C09J163/00;H05K1/02;H05K1/18 | 主分类号 | B32B3/00 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A stiffener-integrated flexible printed circuit board having a structure in which (A) a stiffener, (B) a bonding material, (C) a cured film obtained by curing a photosensitive resin composition, and (D) a flexible printed circuit board are laminated in this order. | ||
| 地址 | Osaka JP | ||