发明名称 |
Compressor assembly having electronics cooling system and method |
摘要 |
A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module. |
申请公布号 |
US8826682(B2) |
申请公布日期 |
2014.09.09 |
申请号 |
US200812244387 |
申请日期 |
2008.10.02 |
申请人 |
Emerson Climate Technologies, Inc. |
发明人 |
Caillat Jean-Luc M. |
分类号 |
F25B41/00;F04B53/08;F04B39/06;F25B31/00;F04B49/10;F25B13/00 |
主分类号 |
F25B41/00 |
代理机构 |
Harness, Dickey & Pierce, P.L.C. |
代理人 |
Harness, Dickey & Pierce, P.L.C. |
主权项 |
1. A system comprising:
a compressor having a suction side for receiving low-pressure refrigerant and a discharge side for dispensing high-pressure refrigerant; a pair of heat exchangers in communication with said compressor; an expansion valve disposed between said heat exchangers; a control module for controlling said expansion valve; an electronics module externally mounted to the compressor; a cooling apparatus mounted to the electronics module that receives said low-pressure refrigerant to cool said electronic module; a temperature sensor located at an inlet of said cooling apparatus, said temperature sensor for detecting a temperature of said low-pressure refrigerant entering said cooling apparatus, wherein said control module is in communication with said temperature sensor, and controls said expansion valve based on said temperature of said low-pressure refrigerant to minimize an amount of said low-pressure refrigerant in a liquid phase passing through said cooling apparatus. |
地址 |
Sidney OH US |