发明名称 Compressor assembly having electronics cooling system and method
摘要 A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module.
申请公布号 US8826682(B2) 申请公布日期 2014.09.09
申请号 US200812244387 申请日期 2008.10.02
申请人 Emerson Climate Technologies, Inc. 发明人 Caillat Jean-Luc M.
分类号 F25B41/00;F04B53/08;F04B39/06;F25B31/00;F04B49/10;F25B13/00 主分类号 F25B41/00
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A system comprising: a compressor having a suction side for receiving low-pressure refrigerant and a discharge side for dispensing high-pressure refrigerant; a pair of heat exchangers in communication with said compressor; an expansion valve disposed between said heat exchangers; a control module for controlling said expansion valve; an electronics module externally mounted to the compressor; a cooling apparatus mounted to the electronics module that receives said low-pressure refrigerant to cool said electronic module; a temperature sensor located at an inlet of said cooling apparatus, said temperature sensor for detecting a temperature of said low-pressure refrigerant entering said cooling apparatus, wherein said control module is in communication with said temperature sensor, and controls said expansion valve based on said temperature of said low-pressure refrigerant to minimize an amount of said low-pressure refrigerant in a liquid phase passing through said cooling apparatus.
地址 Sidney OH US
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