发明名称 |
Multilayer packaged semiconductor device and method of packaging |
摘要 |
One embodiment is a packaged device having multiple layers. Another embodiment is a method of forming a packaged device having multiple layers. Conductive layers and insulating layers can be formed with openings exposing semiconductor devices. The semiconductor devices can be wire-bonded to the conductive layers. In some embodiments, parasitic effects and a relative footprint of the packaged device can be reduced. |
申请公布号 |
US8829692(B2) |
申请公布日期 |
2014.09.09 |
申请号 |
US201213603377 |
申请日期 |
2012.09.04 |
申请人 |
Rolls-Royce Corporation |
发明人 |
Rajashekara Kaushik;Wang Ruxi;Chen Zheng;Boroyevich Dushan |
分类号 |
H01L23/053;H01L23/48 |
主分类号 |
H01L23/053 |
代理机构 |
Krieg DeVault LLP |
代理人 |
Krieg DeVault LLP |
主权项 |
1. A packaged device, comprising:
a first conductive layer; a semiconductor device attached to the first conductive layer; a first insulating layer over the first conductive layer, the first insulating layer including an opening exposing the semiconductor device; a second conductive layer over the first insulating layer, the second conductive layer including an opening exposing the semiconductor device; a second insulating layer over the second conductive layer, the second insulating layer including an opening exposing the semiconductor device; a third conductive layer over the second insulating layer, the third conductive layer including an opening exposing the semiconductor device; a first bondwire coupled between the semiconductor device and the second conductive layer; a second bondwire coupled between the semiconductor device and the third conductive layer; and wherein the first insulating layer is substantially adjacent to the semiconductor device. |
地址 |
Indianapolis IN US |