Stackable semiconductor package with encapsulant and electrically conductive feed-through

摘要

A description is given of a device comprising a first semiconductor chip, a molding compound layer embedding the first semiconductor chip, a first electrically conductive layer applied to the molding compound layer, a through hole arranged in the molding compound layer, and a solder material filling the through hole.

主权项

1. A device, comprising:
a first semiconductor chip having an active surface with a contact pad thereon; a molding compound layer embedding the first semiconductor chip such that the active surface and the contact pad are exposed from the molding compound layer, the molding compound having a first surface and a second surface parallel to the first surface; a first electrically conductive layer applied to the first surface of the molding compound layer, wherein the active surface of the first semiconductor chip faces away from the first electrically conductive layer; a substantially cylindrical through hole arranged in the molding compound layer extending from the first surface to the second surface; a first dielectric layer on the first surface and the first electrically conductive layer and having an opening therein to form an external contact pad situated on the first surface laterally displaced from the through hole such that the external contact pad is arranged completely outside a periphery of the through hole, and such that there is no opening in the first dielectric layer forming an external contact directly over the through hole; a solder material filling the through hole, wherein the first electrically conductive layer electrically couples the solder material to the external contact pad that is laterally displaced relative to the through hole; a second electrically conductive layer applied to the second surface of the molding compound layer that is arranged over the active surface of the first semiconductor chip, and wherein the second electrically conductive layer electrically couples the contact pad of the first semiconductor chip to the solder material; and a dielectric layer on the second surface and the second electrically conductive layer and having an opening therein to form a second external contact pad situated on the second surface of the molding compound layer and laterally displaced from the through hole such that the second external contact pad is arranged completely outside a periphery of the through hole and no external contact pad is on the second surface within the periphery of the through hole, and wherein the second electrically conductive layer electrically couples the second external contact pad to the solder material.