发明名称 |
Method for forming semiconductor layout patterns, semiconductor layout patterns, and semiconductor structure |
摘要 |
A method for forming semiconductor layout patterns providing a pair of first layout patterns being symmetrical along an axial line, each of the first layout patterns comprising a first side proximal to the axial line and a second side far from the axial line; shifting a portion of the first layout patterns toward a direction opposite to the axial line to form at least a first shifted portion in each first layout pattern, and outputting the first layout patterns and the first shifted portions on a first mask. |
申请公布号 |
US8829610(B2) |
申请公布日期 |
2014.09.09 |
申请号 |
US201213471468 |
申请日期 |
2012.05.15 |
申请人 |
United Microelectronics Corp. |
发明人 |
Zhao Jie;Wu Huabiao |
分类号 |
H01L29/66 |
主分类号 |
H01L29/66 |
代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
主权项 |
1. A semiconductor structure comprising:
a pair of first diffusion regions formed on a substrate and being symmetrical along an axial line, each of the first diffusion regions comprising:
a plurality of first straight-lined portions; andat least a first curved portion formed in between the first straight-lined portions; and a pair of gate layers being symmetrical along the axial line and perpendicular to the first diffusion regions, the gate layers overlapping the first curved portions, respectively. |
地址 |
Science-Based Industrial Park, Hsin-Chu TW |