Method and apparatus for peeling electronic component

摘要

A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.

主权项

1. A method of peeling an electronic component, comprising:
bringing a bellowphragm into contact with a second main surface, which is a main surface of a tape member, when the electronic component is adhered onto a first main surface of the tape member, the first main surface is another main surface of the tape member; and after the bellowphragm is brought into contact with the second main surface, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm, so as to perform peeling the electronic component from the tape member while the electronic component is being vacuumed and held by a vacuum device; and detecting a rate of rise per unit time in pressure inside the bellowphragm by a gauge to measure a contact force by which the electronic component contacts the vacuum device.