发明名称 Overmolded LED light assembly and method of manufacture
摘要 In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion. In a further aspect, a method of manufacturing an LED lighting apparatus is provided.
申请公布号 US8827508(B2) 申请公布日期 2014.09.09
申请号 US201012910340 申请日期 2010.10.22
申请人 Thermal Solution Resources, LLC 发明人 Sagal E. Mikhail
分类号 F21K99/00;F21V15/01;F21V31/04;B29C45/14;F21V29/00;F21V19/00;B29C45/00;F21Y101/02;F21V17/16 主分类号 F21K99/00
代理机构 McLane, Graf, Raulerson & Middleton, Professional Association 代理人 McLane, Graf, Raulerson & Middleton, Professional Association
主权项 1. An LED lighting apparatus, comprising: an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side; at least one LED mounted on the exterior side of the electronic circuit board central portion; a thermally conductive housing enclosing said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material; said thermally conductive housing together with the exterior side of the electronic circuit board cooperating to define a first cavity, said first cavity proximate adjacent the central portion of the electronic circuit board exterior side; and said thermally conductive housing together with the interior side of the electronic circuit board cooperating to define a second cavity, said second cavity proximate the central portion of the electronic circuit board interior side, a portion of said thermally conductive housing being overmolded onto said peripheral portion.
地址 Narragansett RI US