| 摘要 |
The invention relates to an arrangement for a modular inverter. The arrangement comprises a number of power semiconductors (5, 7) and cooling elements (2), the cooling elements being connected to the power semiconductors (5, 7) for cooling them, wherein the power semiconductors (5, 7) and the cooling elements (2) are disposed around a centre axis (9) of the arrangement in such a manner that they demark a channel (10) around the centre axis (9) in which a cooling medium is able to flow in the direction of the centre axis. The invention is characterized in that the arrangement further comprises a first tube-shaped ring film capacitor (11) around the centre axis (9) of the arrangement wherein the power semiconductors (5, 7) are arranged between the cooling elements (2) and an inner surface of the first ring film capacitor (11). |
