Sensor manufacturing method

摘要

A sensor manufacturing method and a microphone structure produced by using the same. Wherein, thermal oxidation method is used to form a sacrifice layer of an insulation layer on a silicon-on-insulator (SOI) substrate or a silicon substrate, to fill patterned via in said substrate. Next, form a conduction wiring layer on the insulation layer. Since the conduction wiring layer is provided with holes, thus etching gas can be led in through said hole, to remove filling in the patterned via, to obtain an MEMS sensor. Or after etching of the conduction wiring layer, deep reactive-ion etching is used to etch the silicon substrate into patterned via, to connect the substrate electrically to a circuit chip. The manufacturing process is simple and the technology is stable and mature, thus the conduction wiring layer and the insulation layer are used to realize electrical isolation.

主权项

1. A sensor manufacturing method, comprising following steps:
provide a silicon-on-insulator (SOI) substrate, a silicon layer of said SOI substrate is penetrated with at least a trench; form at least a patterned via through said silicon layer, and form at least a sacrifice layer on said silicon layer, to fill said trench and said patterned via; remove part of said sacrifice layer, to expose said silicon layer, and form a first metal layer on said sacrifice layer, to connect it electrically to said silicon layer; at a position corresponding to said patterned via, form at least an opening in said first metal layer, to expose said sacrifice layer, and form a first insulation layer to fill said opening; and form a first insulation block on said first insulation layer, form a second insulation block and a metal block on said first metal layer, such that said first insulation block and said second insulation block are adjacent to said metal block, and are located respectively inside and outside said metal block to form a second metal layer having at least a hole with its position corresponding to that of said patterned via on said first insulation block, said second insulation block, and said metal block, and forma second insulation layer in said hole to be located on said first insulation block; and through said hole, remove said sacrifice layer in said patterned via.