发明名称 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same
摘要 A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.
申请公布号 US8828643(B2) 申请公布日期 2014.09.09
申请号 US201313782148 申请日期 2013.03.01
申请人 FUJIFILM Corporation 发明人 Kobayashi Hiromi;Inabe Haruki
分类号 C07C69/54;H01L21/027 主分类号 C07C69/54
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A positive type resist composition for use in liquid immersion exposure comprising: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble resin having one or more fluorine atoms; and (D) a solvent, wherein the structure of resin (A) and the structure of resin (C) are not the same, the amount of the alkali soluble resin (C) is 1 to 10% by mass based on the total solid components in the resist composition, and the alkali soluble resin (C) contains an alkyl group having 1 to 10 carbon atoms substituted by at least one fluorine atom.
地址 Tokyo JP