Metallic frame structure and LED device having the same

摘要

The present invention relates to an LED device, which includes a metallic frame, an LED chip, and a packaging body. The metallic frame includes a first lead frame and a second lead frame. The first lead frame has a protruding portion extending toward the second lead frame, while the second lead frame has a notch formed correspondingly to the protruding portion. An electrically insulated region is cooperatively defined by the first and second lead frames. The metallic frame defines at least one blind hole in proximate to the electrically insulated region. The LED chip is electrically connected to the first and second lead frames. The packaging body has a base portion encapsulating the metallic frame and a light-permitting portion arranged above the LED chip.

主权项

1. A metallic frame structure, comprising:
a metallic frame having an imaginary plane and including
a first lead frame having a protruding portion;a second lead frame, the protruding portion extending toward the second lead frame; andan electrically insulated region defined between the first and second lead frames; wherein a biggest circle is defined on the imaginary plane; wherein at least one first blind hole and at least one second blind hole are selectively formed on at least one of the first lead frame and the second lead frame, the first blind hole formed concavely on an upper surface of the metallic frame and located substantially adjacent to a circumference of the biggest circle, and the second blind hole formed in proximate to the electrically insulated region; wherein the at least one first blind hole is distributed around the chip-mounting area that the at least one chip is mounted thereon, and the at least one second blind hole is communicated with the electrically insulated region.