WIRING BOARD, MOUNTING STRUCTURE INCLUDING WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of increasing electric reliability, and to provide a mounting structure including the wiring board and a method for manufacturing the wiring board.SOLUTION: A via hole V included in a wiring board 4 according to one embodiment of the invention includes: a first penetrating portion V1 which penetrates a film layer 13 in a thickness direction while reducing a width thereof from a side of a first principal surface 10a toward a side of a second principal surface 10b; a second penetrating portion V2 which penetrates a region of a bonding layer 14 at a side of the first principal surface 10a in the thickness direction while reducing a width thereof from the side of the first principal surface 10a toward a side of the second principal surface 10b; and a third penetrating portion V3 which penetrates a region of the bonding layer 14 at the side of the second principal surface 10b in the thickness direction while reducing a width thereof from the side of the first principal surface 10a toward the side of the second principal surface 10b. An inclination angle of an inner wall W3 of the third penetrating portion V3 with respect to the penetrating direction of the via hole V is smaller than an inclination angle of an inner wall W2 of the second penetrating portion V2 with respect to the penetration direction of the via hole V.