| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component housing package and an electronic device that are able to decrease distortion caused by heat stress of a package and are able to satisfactorily and externally dissipate light generated from the electronic device.SOLUTION: The electronic component housing package comprises: a first metal board 1 having a placement part for placing an electronic component 4 on the upper main surface of an approximately quadrangular plate, and also having first screw mounting parts 1a extended from both ends of one side S1; a second board 2 having second screw mounting parts 2a extended from both short sides of an approximately rectangular plate, and arranged such that its long sides extend along the other side S2 of the first board 1 opposite the one side S1; and a frame 3 surrounding the placement part and joined to the upper surfaces of the first board 1 and the second board 2 so as to cover a boundary between the first board 1 and the second board 2. Accordingly, heat stress caused between the first board 1, and the second board 2 and the frame 3 can be decreased. |
