PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing a phenolic resin, which shows excellent storage stability, can be cured at a lower temperature, and gives a cured film that suppresses pattern abnormality even when a wafer with a cured relief pattern is subjected to a reflow process, to provide a method for producing a cured relief pattern for forming a pattern by using the photosensitive resin composition, and to provide a semiconductor device and a display device having the cured relief pattern.SOLUTION: There is provided a positive photosensitive resin composition comprising: (A) 100 pts.mass of a phenolic resin; (B) 0.01 to 20 pts.mass of at least one nitrogen-containing compound selected from a group consisting of a tetrazole compound and a purine compound; and (C) 0.1 to 70 pts.mass of a compound having a quinonediazide group.