| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a high reliable circuit board superior in via-connection stability.SOLUTION: In the manufacturing method of a circuit board, a porous or concave and convex sheet 4 is placed between laminated prepregs 3, and the laminated prepregs 3 are rested or stored to stabilize the laminated prepregs dimensionally; and accordingly, variation in dimensional changes within a production lot is reduced. Thus, a circuit board with a high positional accuracy and superior productivity is achieved. |
