| 摘要 |
PROBLEM TO BE SOLVED: To provide a pick-up device for a semiconductor chip which can certainly remove a semiconductor chip pasted on an adhesive sheet without damaging.SOLUTION: A pick-up device for a semiconductor chip, is composed of a collet for sucking and holding an upper surface of a semiconductor chip; a stage for adhering tightly to a surface of the adhesive sheet on the opposite side to a surface where the semiconductor chip is attached; and a suction means for sucking the adhesive sheet from a back surface of the stage. The stage is composed of a support face for supporting the semiconductor chip in contact with the adhesive sheet and being deformed in a direction that the adhesive sheet is peeled from the semiconductor chip while sucking the adhesive sheet; and a suction surface having a plurality of suction holes for sucking the adhesive sheet. |
