| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a short circuit between a bump and a metal wiring does not occur.SOLUTION: The semiconductor device comprises: a metal wiring 110 in a top layer; a pad metal in a same layer as the metal wiring 110; a side spacer 130 provided in a sidewall of the metal wiring 110; a protective film 120 which is provided on the metal wiring 110 and the side spacer 130 and has an opening from which the pad metal is exposed; and a bump provided on the pad metal and the protective film 120. |
