| 摘要 |
PROBLEM TO BE SOLVED: To divide a wafer into individual lamination chips reliably even if the chip side is stuck to an adhesive sheet, in a laminated wafer where a plurality of chips are laminated on a wafer.SOLUTION: A protrusion 3 corresponding to the outer peripheral excessive region 1B of a laminated wafer 1 is formed on a glue layer 22 of an adhesive sheet 2, and the glue layer 22 is stuck to a chip 15 for the laminated wafer 1, and the protrusion 3 is stuck to the surface 10a of a wafer 10 corresponding to the outer peripheral excessive region 1B, thus supporting the outer peripheral excessive region 1B of the wafer 10 by the protrusion 3. From this state, a split start point (modified layer 10c) to the wafer 10 is formed along a split schedule line 11, and an external force is given to the wafer 10 by expansion of the adhesive sheet 2 thus splitting even the lamination chip 1c on the outermost part similarly to other lamination chip 1c. |
