| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip having high productivity capable of reducing warpage of a semiconductor wafer to such a degree that machine transportation becomes possible.SOLUTION: A method of manufacturing a semiconductor chip having a protection film on a non-circuit surface of the semiconductor chip, includes a step of adhering a protection film for a semiconductor wafer on the non-circuit surface side of the semiconductor wafer in which a device for ejecting the semiconductor chip is formed on one surface, and preparatorily dicing the semiconductor wafer to which the protection film for a semiconductor wafer is adhered, from the circuit surface side to cut only the semiconductor wafer and not to cut the protection film for a semiconductor wafer. |
