WIRING STRUCTURE, MANUFACTURING METHOD OF THE SAME, DROPLET DISCHARGE HEAD, AND DROPLET DISCHARGE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring structure which secures a wide pitch between multiple wiring lines.SOLUTION: A droplet discharge head 1 includes: a diaphragm 23 where a terminal 27 is formed; a reservoir formation substrate 24 which is joined to the diaphragm 23 and has a penetration part 246 including an inclined surface, which makes an acute angle relative to the diaphragm 23, as an inner wall 247; a substrate 32 which is positioned at the opposite side of the diaphragm 23 through the reservoir formation substrate 24 and is joined to the reservoir formation substrate 24, the substrate 32 where a terminal 341a is formed; an IC package 33 mounted on the substrate 32 and electrically connected with the terminal 341a; and a wiring line 281 formed on the inclined surface and electrically connecting the terminal 27 with the terminal 341a.