发明名称 CURABLE RESIN COMPOSITION, SEALING MATERIAL, VERTICAL CONDUCTION MATERIAL, PHOTOELECTRIC CONVERTER, DYE-SENSITIZED SOLAR CELL AND DYE-SENSITIZED SOLAR CELL MODULE
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition having an improved substrate adhesion property, a sealing material and a vertical conduction material using the curable resin composition, a photoelectric converter, a dye-sensitized solar cell and a dye-sensitized solar cell module using the sealing material and/or the vertical conduction material.SOLUTION: There is provided a curable resin composition having an atom group represented by the general formula X, containing an epoxy compound (A) having a straight-chain structure to which three or more methine groups and/or methylene groups are bound, and having a percentage content of the epoxy compound (A) of 10 to 90 mass%. In the formula, Rrepresents a hydrogen atom or a bivalent or more hydrocarbon group having 1 to 30 carbon atoms, at least one carbon atom in the hydrocarbon group may be substituted by a hetero atom, and at least one hydrogen atom bound to a carbon atom or a hetero atom in the hydrocarbon group may be substituted by a hydrocarbon group having 1 to 10 carbon atoms or a hetero atom.
申请公布号 JP2014162911(A) 申请公布日期 2014.09.08
申请号 JP20130037999 申请日期 2013.02.27
申请人 SEKISUI CHEM CO LTD 发明人 NAKAJIMA HIDEYASU
分类号 C08G59/14;C08G59/66;H01B1/22;H01M2/10;H01M14/00 主分类号 C08G59/14
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